JNTC is poised to begin mass production of glass substrates for high-performance AI semiconductors from August 2025, leveraging proprietary technology that is designed to minimize heat generation and distortion. The company aims to produce up to 500,000 units annually across facilities in South Korea and Vietnam, with sales targets of 200 billion won ($145 million) for 2026 and 1 trillion won by 2028.

In a press briefing held Monday at the Korea Exchange in Yeouido, JNTC unveiled its new Through Glass Via (TGV) glass substrate technology. The company plans to begin production in the second half of this year and achieve 20 billion won in revenue within 2025.

Chairman Jang Sang-wook said the rapid development of the TGV technology was made possible by decades of accumulated expertise in glass etching and plating. JNTC, which has specialized in camera lens covers and precision marking for nearly two decades, also tapped into synergies with its affiliate COMET which brings more than 30 years of plating experience.

Jang said that the company is completing a factory in Hwaseong, Gyeonggi Province, with an annual production capacity of 120,000 substrates. He added that JNTC also plans to build another facility in Vietnam capable of producing 360,000 units annually.

Originally focused on reinforced glass for smartphone camera lenses and charging connectors, JNTC pivoted to glass substrates in April 2024 as the technology gained attention in semiconductor packaging. The company showcased nine core innovations, including laser-based microcrack control, void-free full plating, and plating thickness equalization at the event.

One standout feature is the precise alignment of upper and lower hole diameters on the glass substrate, along with the ability to achieve stable plating even on ultra-thin glass as narrow as 0.2 to 0.7 millimeters. JNTC said it has already signed nondisclosure agreements with 16 global semiconductor companies.

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