Hanmi Semiconductor Co., South Korea’s leading producer of thermal compression (TC) bonders, announced on Thursday that it launched a dedicated team for TC Bonder 4, an equipment exclusively used for the production of HBM4, sixth-generation high-bandwidth memory (HBM).

Silver Phoenix consists of over 50 skilled semiconductor equipment specialists to swiftly respond to a wide range of technical requests from customers, as well as to handle maintenance and optimization of the equipment.

Hanmi Semiconductor is also providing 30 eco-friendly hybrid four-wheel- drive (4WD) sports utility vehicles (SUVs) to ensure the dedicated team can deliver safe and swift premium services.

TC Bonder is a key piece of equipment used in the production of HBM semiconductors for artificial intelligence (AI) applications.

HBM is made by stacking multiple DRAM chips, and TC Bonder is used in the process of applying heat and pressure to bond the DRAM layers.

TC Bonder 4, released in May, is a dedicated equipment for HBM4 production.

It has significantly improved productivity and precision compared to previous models to meet the stringent accuracy requirements of HBM4.

[ⓒ 매일경제 & mk.co.kr, 무단 전재, 재배포 및 AI학습 이용 금지]